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[Report][Added] Thickness units to the templates
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Closes #685
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@set-soft
set-soft committed Oct 14, 2024
1 parent 89a5e55 commit 5c33f8f
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1 change: 1 addition & 0 deletions CHANGELOG.md
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Expand Up @@ -9,6 +9,7 @@ and this project adheres to [Semantic Versioning](https://semver.org/spec/v2.0.0
### Added
- Experimental GUI
- SVG: `use_aux_axis_as_origin` option (#681)
- Report: thickness units (#685)

### Fixed
- PCB Print: allow specifying `repeat_for_layer` with empty `repeat_layers`.
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1 change: 1 addition & 0 deletions docs/source/Changelog.rst
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Expand Up @@ -21,6 +21,7 @@ Added

- Experimental GUI
- SVG: ``use_aux_axis_as_origin`` option (#681)
- Report: thickness units (#685)

Fixed
~~~~~
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6 changes: 3 additions & 3 deletions kibot/resources/report_templates/report_full.txt
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Expand Up @@ -37,11 +37,11 @@ Impedance controlled: YES
#?stackup

#?stackup
| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
| Name | Type | Color | Thickness [µm]| Material | Er | Loss tan |
#?stackup
|----------------------|----------------------|------------------|-----------|-----------------|-----------|--------------|
|----------------------|----------------------|------------------|---------------|-----------------|-----------|--------------|
#?stackup
#stackup:| ${%-20s,name} | ${%-20s,type} | ${%-16s,color} | ${%9d,thickness} | ${%-15s,material} | ${%9.1f,epsilon_r} | ${%12.3f,loss_tangent} |
#stackup:| ${%-20s,name} | ${%-20s,type} | ${%-16s,color} | ${%9d,thickness} | ${%-15s,material} | ${%9.1f,epsilon_r} | ${%12.3f,loss_tangent} |
#?stackup

# Important sizes
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6 changes: 3 additions & 3 deletions kibot/resources/report_templates/report_full_svg.txt
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Expand Up @@ -37,11 +37,11 @@ Impedance controlled: YES
#?stackup

#?stackup
| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
| Name | Type | Color | Thickness [µm]| Material | Er | Loss tan |
#?stackup
|----------------------|----------------------|------------------|-----------|-----------------|-----------|--------------|
|----------------------|----------------------|------------------|---------------|-----------------|-----------|--------------|
#?stackup
#stackup:| ${%-20s,name} | ${%-20s,type} | ${%-16s,color} | ${%9d,thickness} | ${%-15s,material} | ${%9.1f,epsilon_r} | ${%12.3f,loss_tangent} |
#stackup:| ${%-20s,name} | ${%-20s,type} | ${%-16s,color} | ${%9d,thickness} | ${%-15s,material} | ${%9.1f,epsilon_r} | ${%12.3f,loss_tangent} |
#?stackup

# Important sizes
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6 changes: 3 additions & 3 deletions kibot/resources/report_templates/report_simple.txt
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Expand Up @@ -35,11 +35,11 @@ Impedance controlled: YES
#?stackup

#?stackup
| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
| Name | Type | Color | Thickness [µm]| Material | Er | Loss tan |
#?stackup
|----------------------|----------------------|------------------|-----------|-----------------|-----------|--------------|
|----------------------|----------------------|------------------|---------------|-----------------|-----------|--------------|
#?stackup
#stackup:| ${%-20s,name} | ${%-20s,type} | ${%-16s,color} | ${%9d,thickness} | ${%-15s,material} | ${%9.1f,epsilon_r} | ${%12.3f,loss_tangent} |
#stackup:| ${%-20s,name} | ${%-20s,type} | ${%-16s,color} | ${%9d,thickness} | ${%-15s,material} | ${%9.1f,epsilon_r} | ${%12.3f,loss_tangent} |
#?stackup

Materials:
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32 changes: 16 additions & 16 deletions tests/reference/6_0_8/light_control-report.txt
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Expand Up @@ -27,22 +27,22 @@ Stackup:

Impedance controlled: YES

| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
|----------------------|----------------------|------------------|-----------|-----------------|-----------|--------------|
| F.SilkS | Top Silk Screen | White | | Liquid Photo | | |
| F.Paste | Top Solder Paste | | | | | |
| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.000 |
| F.Cu | copper | | 35 | | | |
| dielectric 1 | prepreg | | 480 | FR4 | 4.5 | 0.020 |
| In1.Cu | copper | | 35 | | | |
| dielectric 2 | core | | 480 | FR4 | 4.5 | 0.020 |
| In2.Cu | copper | | 35 | | | |
| dielectric 3 (1/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| dielectric 3 (2/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| B.Cu | copper | | 35 | | | |
| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.000 |
| B.Paste | Bottom Solder Paste | | | | | |
| B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | |
| Name | Type | Color | Thickness [µm]| Material | Er | Loss tan |
|----------------------|----------------------|------------------|---------------|-----------------|-----------|--------------|
| F.SilkS | Top Silk Screen | White | | Liquid Photo | | |
| F.Paste | Top Solder Paste | | | | | |
| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.000 |
| F.Cu | copper | | 35 | | | |
| dielectric 1 | prepreg | | 480 | FR4 | 4.5 | 0.020 |
| In1.Cu | copper | | 35 | | | |
| dielectric 2 | core | | 480 | FR4 | 4.5 | 0.020 |
| In2.Cu | copper | | 35 | | | |
| dielectric 3 (1/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| dielectric 3 (2/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| B.Cu | copper | | 35 | | | |
| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.000 |
| B.Paste | Bottom Solder Paste | | | | | |
| B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | |

# Important sizes

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32 changes: 16 additions & 16 deletions tests/reference/6_0_8/light_control-report.txt_2
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Expand Up @@ -27,22 +27,22 @@ Stackup:

Impedance controlled: YES

| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
|----------------------|----------------------|------------------|-----------|-----------------|-----------|--------------|
| F.SilkS | Top Silk Screen | White | | Liquid Photo | | |
| F.Paste | Top Solder Paste | | | | | |
| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.000 |
| F.Cu | copper | | 35 | | | |
| dielectric 1 | prepreg | | 480 | FR4 | 4.5 | 0.020 |
| In1.Cu | copper | | 35 | | | |
| dielectric 2 | core | | 480 | FR4 | 4.5 | 0.020 |
| In2.Cu | copper | | 35 | | | |
| dielectric 3 (1/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| dielectric 3 (2/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| B.Cu | copper | | 35 | | | |
| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.000 |
| B.Paste | Bottom Solder Paste | | | | | |
| B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | |
| Name | Type | Color | Thickness [µm]| Material | Er | Loss tan |
|----------------------|----------------------|------------------|---------------|-----------------|-----------|--------------|
| F.SilkS | Top Silk Screen | White | | Liquid Photo | | |
| F.Paste | Top Solder Paste | | | | | |
| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.000 |
| F.Cu | copper | | 35 | | | |
| dielectric 1 | prepreg | | 480 | FR4 | 4.5 | 0.020 |
| In1.Cu | copper | | 35 | | | |
| dielectric 2 | core | | 480 | FR4 | 4.5 | 0.020 |
| In2.Cu | copper | | 35 | | | |
| dielectric 3 (1/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| dielectric 3 (2/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| B.Cu | copper | | 35 | | | |
| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.000 |
| B.Paste | Bottom Solder Paste | | | | | |
| B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | |

# Important sizes

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32 changes: 16 additions & 16 deletions tests/reference/6_0_8/light_control-report_simple.txt
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Expand Up @@ -25,22 +25,22 @@ Stackup:

Impedance controlled: YES

| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
|----------------------|----------------------|------------------|-----------|-----------------|-----------|--------------|
| F.SilkS | Top Silk Screen | White | | Liquid Photo | | |
| F.Paste | Top Solder Paste | | | | | |
| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.000 |
| F.Cu | copper | | 35 | | | |
| dielectric 1 | prepreg | | 480 | FR4 | 4.5 | 0.020 |
| In1.Cu | copper | | 35 | | | |
| dielectric 2 | core | | 480 | FR4 | 4.5 | 0.020 |
| In2.Cu | copper | | 35 | | | |
| dielectric 3 (1/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| dielectric 3 (2/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| B.Cu | copper | | 35 | | | |
| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.000 |
| B.Paste | Bottom Solder Paste | | | | | |
| B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | |
| Name | Type | Color | Thickness [µm]| Material | Er | Loss tan |
|----------------------|----------------------|------------------|---------------|-----------------|-----------|--------------|
| F.SilkS | Top Silk Screen | White | | Liquid Photo | | |
| F.Paste | Top Solder Paste | | | | | |
| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.000 |
| F.Cu | copper | | 35 | | | |
| dielectric 1 | prepreg | | 480 | FR4 | 4.5 | 0.020 |
| In1.Cu | copper | | 35 | | | |
| dielectric 2 | core | | 480 | FR4 | 4.5 | 0.020 |
| In2.Cu | copper | | 35 | | | |
| dielectric 3 (1/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| dielectric 3 (2/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| B.Cu | copper | | 35 | | | |
| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.000 |
| B.Paste | Bottom Solder Paste | | | | | |
| B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | |

Materials:

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32 changes: 16 additions & 16 deletions tests/reference/7_0_0/light_control-report_simple.txt
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Expand Up @@ -25,22 +25,22 @@ Stackup:

Impedance controlled: YES

| Name | Type | Color | Thickness | Material | Epsilon_r | Loss tangent |
|----------------------|----------------------|------------------|-----------|-----------------|-----------|--------------|
| F.SilkS | Top Silk Screen | White | | Liquid Photo | | |
| F.Paste | Top Solder Paste | | | | | |
| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.000 |
| F.Cu | copper | | 35 | | | |
| dielectric 1 | prepreg | PTFE natural | 480 | FR4 | 4.5 | 0.020 |
| In1.Cu | copper | | 35 | | | |
| dielectric 2 | core | FR4 natural | 480 | FR4 | 4.5 | 0.020 |
| In2.Cu | copper | | 35 | | | |
| dielectric 3 (1/2) | prepreg | Polyimide | 240 | Kapton | 3.2 | 0.004 |
| dielectric 3 (2/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| B.Cu | copper | | 35 | | | |
| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.000 |
| B.Paste | Bottom Solder Paste | | | | | |
| B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | |
| Name | Type | Color | Thickness [µm]| Material | Er | Loss tan |
|----------------------|----------------------|------------------|---------------|-----------------|-----------|--------------|
| F.SilkS | Top Silk Screen | White | | Liquid Photo | | |
| F.Paste | Top Solder Paste | | | | | |
| F.Mask | Top Solder Mask | Blue | 10 | Liquid Ink | 3.3 | 0.000 |
| F.Cu | copper | | 35 | | | |
| dielectric 1 | prepreg | PTFE natural | 480 | FR4 | 4.5 | 0.020 |
| In1.Cu | copper | | 35 | | | |
| dielectric 2 | core | FR4 natural | 480 | FR4 | 4.5 | 0.020 |
| In2.Cu | copper | | 35 | | | |
| dielectric 3 (1/2) | prepreg | Polyimide | 240 | Kapton | 3.2 | 0.004 |
| dielectric 3 (2/2) | prepreg | | 240 | Kapton | 3.2 | 0.004 |
| B.Cu | copper | | 35 | | | |
| B.Mask | Bottom Solder Mask | Red | 10 | Dry Film | 3.3 | 0.000 |
| B.Paste | Bottom Solder Paste | | | | | |
| B.SilkS | Bottom Silk Screen | Black | | Direct Printing | | |

Materials:

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