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First of all thanks for making this great project Open Source. This is not an issue "as itself", just a question.
I'm new into Kicad, and the split-custom-mechanichal-keyboards world, so maybe what I'm asking is not a good idea.
I'm interested in creating something like One with few modifications (add RGBs, and maybe cuttable one of the columns). I'm watching the KS-27_KS-33_HotSwap-1U_DUAL and I was thinking the possibility to add a "through hole" between each pad. This hole must have:
Copper layers: all copper layers
Technichal layers:
F. paste
B.paste
F. mask
B.mask
0.5mm diameter (I don't know if there's an option to create something like a "via" without a hole).
With this idea, there's a "via" in the footprint itself, instead of doing it in the PCB Editor. Something like this . With this, the number of vias in the PCB should be less than in One's, and the addition of tracks should be easier. What do you think?
The same idea could be used in the Diode_TH_SMD_DUAL footprint. Right now, each diode has a via in its side, which in the PCB must be connected with a track in front's pad and back's pad. With the "through hole" in the footprint will be easier to make the tracks, won't be?
I know that maybe this is not the forum to ask this, but for sure you have more knowledge about this that I have.
Thanks!
The text was updated successfully, but these errors were encountered:
Hello!
First of all thanks for making this great project Open Source. This is not an issue "as itself", just a question.
I'm new into Kicad, and the split-custom-mechanichal-keyboards world, so maybe what I'm asking is not a good idea.
I'm interested in creating something like One with few modifications (add RGBs, and maybe cuttable one of the columns). I'm watching the KS-27_KS-33_HotSwap-1U_DUAL and I was thinking the possibility to add a "through hole" between each pad. This hole must have:
With this idea, there's a "via" in the footprint itself, instead of doing it in the PCB Editor. Something like this . With this, the number of vias in the PCB should be less than in One's, and the addition of tracks should be easier. What do you think?
The same idea could be used in the Diode_TH_SMD_DUAL footprint. Right now, each diode has a via in its side, which in the PCB must be connected with a track in front's pad and back's pad. With the "through hole" in the footprint will be easier to make the tracks, won't be?
I know that maybe this is not the forum to ask this, but for sure you have more knowledge about this that I have.
Thanks!
The text was updated successfully, but these errors were encountered: