Fabrication

Fabrication

The MISRC is a 2 sided, 2 layer PCB with a dedicated set of headers for a data interface sub-board (either FX3 USB 3.0 dev board or Tang Nano 20k Currently)

Thanks to assembly services today you can have almost any PCB fabricated!

Tip

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Step 1

Firstly acquire the 3 pre-made products, that enable the MISRC to function.

• Tang Nano to FX3 Header Adaptor
• Tang Nano 20k
• MS2130 USB 3.0 - Order Link 1 / Order Link 2

Step 2

Go to PCBway Shared Project

Select PCB+Assembly

Step 3

Caution

Configure options as listed below in the images/text.

• Turnkey
• Single Pieces
• Both Sides
• 1
• No
• Yes

• Solder Mask - Blue
• Silkscreen - White
• Surface finish - HSL with lead or Immersion Gold ENIG
• Via Process - Plugged with Solder Mask
• Remove Product No - Specify a location

Step 4

Caution

Notice how "Components cost is 0.00 USD" this is due to parts always being quoted after the order is inspected for production.

<img src="assets/images/Fabrication/PCBway-MISRC-Fab-Order-Basket.PNG " width="466 With any board order, you will have to manually confirm a few things via email after placing your order, the PCB is fabricated, parts cost is quoted then you can alter or proceed with population.

Note

Vias should be covered/filled with soldermask (tented vias)

Note

• The vias in the pads are there on purpose:
• There is a bottom pad on the voltage regulator, for hand soldering the vias are necessary to solder that pad, it's there for thermal reasons.

Step 5

Flash your Tang Nano 20k, then add it to your MISRC PCB.

Hand Soldering

(Note add 1-2-3 step images)

As the board is built around 0805 standard size parts most people with a steady handy can hand solder these parts with a Bevel tip and a pair of tweezers.

Step 1:

Clean your PCB with 99.9% IPA, this cleans any surface contaminate off.

Step 2:

Prepare your Flux, Solder 60/40 & Components

Step 3:

You can use solder paste if you have a solder stencil made or manually populate each pad.

Or bare solder via coating the PCB with flux, with a clean and tinned tip populate 1 side of the pad then move the component with tweezers into the pad while melted via iron then simply flow a small amount of solder onto the other pad.

Step 4:

You will want to populate 2.54mm header pins last, and BNCs last as these are the hardest to de-solder and headers easiest to melt and very easy to damage pads without a de-soldering gun.

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